ds-cpc1909 - r05 www.clare.com 1 e 3 rohs 2002/95/ec characteristics features ? 15a rms load current with 5c/w heat sink ? low 0.1 on-resistance ? 60v p blocking voltage ? 2500v rms input/output isolation ? low thermal resistance (0.3 c/w) ? electrically non-conductive thermal pad for heat sink applications ? low drive power requirements ? arc-free with no snubbing circuits ? no emi/rfi generation ? machine insertable, wave solderable applications ? industrial controls / motor control ? robotics ? medical equipment?patient/equipment isolation ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? transportation equipment ? aerospace/defense approvals ? ul 508 certified component: file e69938 pin configuration description clare and ixys have combined to bring optomos ? technology, reliability and com pact size to a new family of high-power solid state relays. as part of this family, the cpc1909 single-pole normally open (1-form-a) solid state power relay is rated for up to 15a rms continuous load current with a 5c/w heat sink. the cpc1909 employs optically coupled mosfet technology to provide 2500v rms of input to output isolation. the output, constructed with efficient mosfet switches and photovoltaic die, uses clare?s patented optomos architecture while the input, a highly efficient gaalas in frared led, provides the optically coupled control. the combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. the unique isoplus-264 package pioneered by ixys allows solid state relays to achieve the highest load current and power ratings. this package features a unique ixys process where the silicon chips are soft soldered onto the direct copper bond (dcb) substrate instead of the traditional copper leadframe. the dcb ceramic, the same substrate used in high power modules, not only provides 2500v rms isolation but also very low thermal resistance (0.3 c/w). ordering information switching characteristics parameter rating units blocking voltage 60 v p load current, t a =25c: with 5c/w heat sink 15 a rms no heat sink 6.5 on-resistance 0.1 r jc 0.3 c/w part description cpc1909j isoplus-264 package (25 per tube) form-a i f i load 10% 90% t on t off cpc1909 single-pole, normally open isoplus?-264 power relay
r05 www.clare.com 2 cpc1909 1 specifications 1.1 absolute maximum ratings @ 25c absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 electrical characteristics @ 25c 1 higher load currents possible with proper heat sinking. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (t c > 60oc) a led drive current of 20ma is recommended. symbol ratings units blocking voltage 60 v p reverse input voltage 5 v input control current 100 ma peak (10ms) 1 a input power dissipation 150 mw isolation voltage, input to output 2500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c parameter conditions symbol minimum typical maximum units output characteristics load current 1 peak t 10ms i l -- 25 a p continuous no heat sink 6.5 continuous t c =25 c 15 a rms continuous t c =99 c i l(99) 7.85 on-resistance 2 i f =10ma, i l =1a r on -0.050.1 off-state leakage current v l =60v p i leak --1 a switching speeds tu r n - o n i f =20ma, v l =10v t on -1525 ms tu r n - o f f t off -0.310 output capacitance v l =25v, f=1mhz c out - 4000 - pf input characteristics input control current 3 i l =1a i f --10ma input dropout current - i f 0.6 - - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 a input/output characteristics capacitance, input-to-output - c i/o -1-pf
preliminary 3 www.clare.com r05 cpc1909 2 thermal characteristics 2.1 thermal management device high current characterization was performed using kunze heat sink ku 1-159, phase change thermal interface material ku-alc 5, and transistor clip ku 4-499/1. this combination provided an approximate junction-to-ambient thermal resistance of 12.5c/w. 2.2 heat sink calculation higher load currents are possible by using lower thermal re sistance heat sink combinations. parameter conditions symbol minimum typical maximum units thermal resistance (junction to case) - r jc --0.3c/w thermal resistance (junction to ambient) free air r ja -33-c/w junction temperature (operating) - t j -40 - 100 c t j = j u nction temperat u re (c), t j 100c * t a = am b ient temperat u re (c) i l(99) = load c u rrent w ith case temperat u re @ 99c (a dc ) i l = desired operating load c u rrent (a dc ), i l i l(max) r jc = thermal resistance, j u nction to case (c/ w ) = 0.3c/ w r ca = thermal resistance of heat sink & thermal interface material , case to am b ient (c/ w ) p d(99) = maxim u m po w er dissipation w ith case temperat u re held at 99oc = 3.33 w * ele v ated j u nction temperat u re red u ces semicond u ctor lifetime. heat sink ratin g r ca = - r jc (t j - t a ) i l(99) 2 i l 2 ? p d(99)
r05 www.clare.com 4 cpc1909 3 performance data unless otherwise specified, all performance dat a was acquired without the use of a heat sink. the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please contact our application department. 35 30 25 20 15 10 5 0 1.30 1.31 1.32 1.33 1.34 led forward volta g e (v) device count (n) typical led forward volta g e drop (n=50, i f =10ma, i l =1a dc , t a =25oc) 35 30 25 20 15 10 5 0 10.0 12.5 15.0 20.0 17.5 22.5 typical turn-on time (n=50, i f =20ma, i l =1a dc , t a =25oc) turn-on (ms) device count (n) 0.23 0.35 0.47 0.17 0.29 0.41 25 20 15 10 5 0 turn-off (ms) device count (n) typical turn-off time (n=50, i f =20ma, i l =1a dc , t a =25oc) 35 30 25 20 15 10 5 0 0.033 0.037 0.041 0.045 0.049 0.053 on-resistance ( ) typical on-resistance distribution (n=50, i f =10ma, i l =1a dc , t a =25oc) device count (n) led forward volta g e drop (v) typical led forward volta g e drop vs. temperature 1. 8 1.6 1.4 1.2 1.0 0. 8 -40 -20 0 20 40 60 8 0 120 100 temperature (oc) i f =50ma i f =20ma i f =10ma led forward current (ma) 0 5 1015202530354045 120 100 8 0 60 40 20 0 50 turn-on (ms) typical turn-on vs. led forward current (i l =1a dc , t a =25oc) led forward current (ma) 0 5 1015202530354045 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 50 turn-off (ms) typical turn-off vs. led forward current (i l =1a dc , t a =25oc) led current (ma) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 8 0 100 typical i f for switch operation vs. temperature (i l =1a dc ) temperature (oc) -40 42 36 30 24 1 8 12 6 0 -20 0 20 40 60 8 0 100 temperature (oc) turn-on (ms) typical turn-on vs. temperature (i l =1a dc ) i f =10ma i f =20ma -40 0.4 8 0.42 0.36 0.30 0.24 0.1 8 0.12 0.06 -20 0 20 40 60 8 0 100 typical turn-off vs. temperature (i l =1a dc ) temperature (oc) turn-off (ms) i f =20ma i f =10ma
preliminary 5 www.clare.com r05 cpc1909 unless otherwise specified, all performance dat a was acquired without the use of a heat sink. the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please contact our application department. -40 0.060 0.05 8 0.056 0.054 0.052 0.050 0.04 8 0.046 0.044 -20 0 20 40 60 8 0 100 on-resistance ( ) typical on-resistance vs. temperature (i f =10ma, i l =1a dc ) temperature (oc) load current (a) -0.54 10 8 6 4 2 0 -2 -4 -6 - 8 -10 -0.36 -0.1 8 0.1 8 0.36 0 0.54 load volta g e (v) typical load current vs. load volta g e (i f =10ma, t a =25oc) 0204060 8 0 100 0 5 10 15 20 1oc/ w 5oc/ w 10oc/ w n o heat sink temperature (oc) load current (a rms ) maximum load current vs. temperature with heat sink (i f =20ma) -40 8 4 8 2 8 0 7 8 76 74 72 70 6 8 -20 0 20 40 60 8 0 100 normalized blockin g volta g e vs. temperature temperature (oc) blockin g volta g e (v p ) -40 0.014 0.012 0.010 0.00 8 0.006 0.004 0.002 0 -20 0 20 40 60 8 0 100 typical leaka g e vs. temperature measured across pins 1&2 (v l =60v p ) temperature (oc) leaka g e ( a) 30 25 20 15 10 5 0 1ms 10s 100s 100ms 10s 10ms 1s 100s time load current (a p ) ener g y ratin g curve free air, no heat sink
r05 www.clare.com 6 cpc1909 4 manufacturing information 4.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 4.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 4.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 4.4 board wash clare recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since clare employs the use of silicone coating as an optical wavegui de in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine-based or fluorine-based solvents or fluxes shoul d not be used. cleaning methods that employ ultrasonic energy should not be used. device moisture sensitivity level (msl) rating cpc1909j msl 1 device maximum temperature x time cpc1909j 245c for 30 seconds e 3 rohs 2002/95/ec
preliminary 7 www.clare.com r05 cpc1909 4.5 mechanical dimensions n ote: back-side heat sink meets 2500 v rms isolation to the pins. 26.162 0.254 (1.030 0.010) 19.914 0.254 (0.7 8 4 0.010) 20.396 0.50 8 (0. 8 03 0.020) 15.240 0.50 8 (0.600 0.020) 3. 8 10 0.254 (0.150 0.010) 2.362 0.3 8 1 (0.093 0.015) 0.635 0.076 (0.025 0.003) 2.794 0.127 (0.110 0.005) 5.029 0.127 (0.19 8 0.005) 1.1 8 1 0.076 (0.047 0.003) 1.930 0.3 8 1 (0.076 0.015) 17.221 0.254 (0.67 8 0.010) 20.600 0.254 (0. 8 11 0.010) 1.270 typ (0.050 typ) dime n sio n s mm (inches) for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-cpc1909-r05 ?copyright 2010, clare, inc. all rights reserved. printed in usa. 11/17/2010
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